Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667547 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Peter R. Ewer, Ken Teasdale | 2003-12-23 |
| 6476481 | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline | Peter R. Ewer, Ken Teasdale | 2002-11-05 |
| 6204554 | Surface mount semiconductor package | Peter R. Ewer | 2001-03-20 |
| 5977630 | Plural semiconductor die housed in common package with split heat sink | George Tyler Pearson, Peter R. Ewer | 1999-11-02 |
| 5902959 | Lead frame with waffled front and rear surfaces | Peter R. Ewer, Alex Kamara, Kevin Smith, Mark Steers | 1999-05-11 |
| 5763949 | Surface-mount semiconductor package | Peter R. Ewer | 1998-06-09 |
| 5760472 | Surface mount semiconductor package | Peter R. Ewer | 1998-06-02 |