| 12170240 |
Lead frame for improving adhesive fillets on semiconductor die corners |
Rennier Rodriguez, Jefferson Talledo |
2024-12-17 |
| 12159820 |
Flat no-lead package with surface mounted structure |
Rennier Rodriguez, Aiza Marie Agudon |
2024-12-03 |
| 12074100 |
Flat no-lead package with surface mounted structure |
Rennier Rodriguez, Aiza Marie Agudon |
2024-08-27 |
| 11664239 |
Lead frame for improving adhesive fillets on semiconductor die corners |
Rennier Rodriguez, Jefferson Talledo |
2023-05-30 |
| 11404355 |
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same |
Rennier Rodriguez, Bryan Christian Bacquian, David Gani |
2022-08-02 |
| 11037864 |
Lead frame for improving adhesive fillets on semiconductor die corners |
Rennier Rodriguez, Jefferson Talledo |
2021-06-15 |
| 10892212 |
Flat no-lead package with surface mounted structure |
Rennier Rodriguez, Aiza Marie Agudon |
2021-01-12 |
| 10763194 |
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same |
Rennier Rodriguez, Bryan Christian Bacquian, David Gani |
2020-09-01 |