ML

Mark Tiam Weng Lam

IBM: 6 patents #16,453 of 70,183Top 25%
📍 Singapore, SG: #1,452 of 13,971 inventorsTop 15%
Overall (All Time): #828,821 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
10605850 Screening methodology to eliminate wire sweep in bond and assembly module packaging Stephen P. Ayotte, Michael Russell Uy Gonzales 2020-03-31
10168692 Production line quality processes Ooi T. Ong 2019-01-01
9551640 Wire-pull test location identification on a wire of a microelectronic package Katsuyuki Yonehara 2017-01-24
9470740 Screening methodology to eliminate wire sweep in bond and assembly module packaging Stephen P. Ayotte, Michael Russell Uy Gonzales 2016-10-18
9255867 Wire-pull test location identification on a wire of a microelectronic package Katsuyuki Yonehara 2016-02-09
9229446 Production line quality processes Ooi T. Ong 2016-01-05