Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9551640 | Wire-pull test location identification on a wire of a microelectronic package | Mark Tiam Weng Lam | 2017-01-24 |
| 9255867 | Wire-pull test location identification on a wire of a microelectronic package | Mark Tiam Weng Lam | 2016-02-09 |
| 8952551 | Semiconductor package and method for fabricating the same | Takashi Hisada | 2015-02-10 |
| 8446735 | Semiconductor package | — | 2013-05-21 |
| 5394675 | Tab tape, method of bonding tab tape and tab tape package | — | 1995-03-07 |
| 5243141 | Tab tape, method of bonding tab tape and tab tape package | — | 1993-09-07 |