| 9796063 |
Multi-layered chemical-mechanical planarization pad |
Paul Andre Lefevre, Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu +2 more |
2017-10-24 |
| 9375822 |
Polishing pad having micro-grooves on the pad surface |
Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh |
2016-06-28 |
| 8900036 |
Polishing pad having micro-grooves on the pad surface |
Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh |
2014-12-02 |
| 8790165 |
Multi-layered chemical-mechanical planarization pad |
Paul Andre Lefevre, Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu +2 more |
2014-07-29 |
| 8758659 |
Method of grooving a chemical-mechanical planarization pad |
Paul Andre Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Guangwei Wu +1 more |
2014-06-24 |
| 8491360 |
Three-dimensional network in CMP pad |
Paul Andre Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh |
2013-07-23 |
| 8430721 |
Chemical-mechanical planarization pad |
Oscar K. Hsu, Paul Andre Lefevre, John Erik Aldeborgh, David Adam Wells |
2013-04-30 |
| 8377351 |
Polishing pad with controlled void formation |
Paul Andre Lefevre, David Adam Wells, Oscar K. Hsu, John Erik Aldeborgh, Scott Xin Qiao +2 more |
2013-02-19 |
| 8172648 |
Chemical-mechanical planarization pad |
Paul Andre Lefevre, Oscar K. Hsu, John Erik Aldeborgh, David Adam Wells |
2012-05-08 |
| 8137166 |
Polishing pad having micro-grooves on the pad surface |
Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh |
2012-03-20 |
| 7985121 |
Chemical-mechanical planarization pad having end point detection window |
Paul Andre Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh |
2011-07-26 |