Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068874 | Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) | Donald W. Nelson, Patrick Morrow, Kimin Jun | 2018-09-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068874 | Method for direct integration of memory die to logic die without use of thru silicon vias (TSV) | Donald W. Nelson, Patrick Morrow, Kimin Jun | 2018-09-04 |