Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11235404 | Personalized copper block for selective solder removal | Charles L. Arvin, Thomas J. Brunschwiler, Thomas Weiss, Chris Muzzy | 2022-02-01 |
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Charles L. Arvin, Kevin Drummond, Thomas J. Brunschwiler, Stephanie Allard, Kenneth C. Marston +1 more | 2021-11-02 |
| 11158450 | Particle-based, anisotropic composite materials for magnetic cores | Arvind Raj Mahankali Sridhar, Thomas J. Brunschwiler, Suiying Ye, Jens Oliver Ammann | 2021-10-26 |
| 10777496 | Chip packages with sintered interconnects formed out of pads | Thomas J. Brunschwiler, Jonas Zürcher | 2020-09-15 |