Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355989 | Wire bonding device and method of eliminating defective bonding wire | Wei Lin, Lung-Tang Hung, Meng-Hung Yeh, Yude Chu | 2016-05-31 |
| 7459770 | Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure | Wen-Shan Tsai, Chien-Feng Wei, Hung-Wen Liu, Ming-Cheng Lin | 2008-12-02 |
| 7180161 | Lead frame for improving molding reliability and semiconductor package with the lead frame | Wei Lin | 2007-02-20 |
| 6696749 | Package structure having tapering support bars and leads | Chin-Yuan Hung | 2004-02-24 |
| 6642735 | Semiconductor package for chip with testing contact pad connected to outside | Ya-Yi Lai | 2003-11-04 |
| 6476469 | Quad flat non-leaded package structure for housing CMOS sensor | Chin-Yuan Hung, Cheng-Shiu Hsiao | 2002-11-05 |