Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886252 | Method of bonding semiconductor substrates | Soon-Wook Kim, Eric Beyne, Gerald Beyer, Erik Sleeckx, Robert C. Miller | 2021-01-05 |
| 10141284 | Method of bonding semiconductor substrates | Soon-Wook Kim, Patrick Verdonck, Robert C. Miller, Gerald Beyer, Eric Beyne | 2018-11-27 |
| 9632917 | Software testing | Duan Cai, Liu Hao, Qiang Li, Yan Yan, Chuan Jie Zheng | 2017-04-25 |