Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418259 | Apparatus for laminating a tape film on a substrate and a system of fabricating a semiconductor device using the same | Youngmin Kim, Jaeyong Park, Byung-Joo Jo | 2019-09-17 |
| 10211084 | Chuck table and substrate processing system including the same | Doojin Kim, Youngsik Kim, Yongdae Ha | 2019-02-19 |
| 7989939 | Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire | Hyun-Ik Hwang, Yongjin Jung | 2011-08-02 |