Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815645 | Multi-chip stacking method to reduce voids between stacked chips | Yung-Hsiang Chen, Wen-Chun Chiu | 2014-08-26 |
| 8361841 | Mold array process method to encapsulate substrate cut edges | Yung-Hsiang Chen, Wen-Chun Chiu | 2013-01-29 |
| 8112854 | Tool holding device for a five-axis lathe | — | 2012-02-14 |
| 8093104 | Multi-chip stacking method to reduce voids between stacked chips | Yung-Hsiang Chen, Wen-Chun Chiu | 2012-01-10 |
| 7768112 | Semiconductor package fabricated by cutting and molding in small windows | Yung-Hsiang Chen | 2010-08-03 |
| 7723157 | Method for cutting and molding in small windows to fabricate semiconductor packages | Yung-Hsiang Chen | 2010-05-25 |
| 6486564 | Heat dissipation module for a BGA IC | Wen-Chun Liu, Yi Pan | 2002-11-26 |