Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815645 | Multi-chip stacking method to reduce voids between stacked chips | Kuo-Yuan Lee, Yung-Hsiang Chen | 2014-08-26 |
| 8361841 | Mold array process method to encapsulate substrate cut edges | Kuo-Yuan Lee, Yung-Hsiang Chen | 2013-01-29 |
| 8093104 | Multi-chip stacking method to reduce voids between stacked chips | Kuo-Yuan Lee, Yung-Hsiang Chen | 2012-01-10 |
| 7969083 | Discharge lamp and production method thereof | Tjong-Ren Chang, Jin-Yuh Lu, Wei-Yuan Tsou | 2011-06-28 |
| 7677945 | Method of forming an external electrode fluorescent lamp, thick film electrode compositions used therein, and lamps and LCD devices formed thereof | Joel Skutsky, Brian D. Veeder, Andy Zao, Thomas Lin, Hsiu-Wei Wu +3 more | 2010-03-16 |