Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7205658 | Singulation method used in leadless packaging process | Jun-Hong Lee, Hyung Jun Park, Hyeong-No Kim | 2007-04-17 |
| 6861295 | Low-pin-count chip package and manufacturing method thereof | Kyujin Jung, Hyung Jun Park | 2005-03-01 |
| 6773961 | Singulation method used in leadless packaging process | Jun-Hong Lee, Hyung Jun Park, Hyeong-No Kim | 2004-08-10 |
| 6528893 | Low-pin-count chip package and manufacturing method thereof | Kyujin Jung | 2003-03-04 |
| 6495909 | Low-pin-count chip package and manufacturing method thereof | Kyujin Jung | 2002-12-17 |
| 6489218 | Singulation method used in leadless packaging process | Hyeongno Kim, Hyung Jun Park, Sangbae Park, Junhong LEE, Bae Doo Kim | 2002-12-03 |
| 6355502 | Semiconductor package and method for making the same | Hyung Jun Park, J. H. Lee | 2002-03-12 |
| 6342730 | Low-pin-count chip package and manufacturing method thereof | Kyujin Jung, Hyung Jun Park | 2002-01-29 |
| 6333252 | Low-pin-count chip package and manufacturing method thereof | Kyujin Jung | 2001-12-25 |
| 6261864 | Low-pin-count chip package and manufacturing method thereof | Kyujin Jung | 2001-07-17 |
| 6242284 | Method for packaging a semiconductor chip | Kyujin Jung, Hyung Jun Park, Jun-Hong Lee | 2001-06-05 |