Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7576415 | EMI shielded semiconductor package | Sang-Jin Cha | 2009-08-18 |
| 7566962 | Semiconductor package structure and method for manufacturing the same | — | 2009-07-28 |
| 7169651 | Process and lead frame for making leadless semiconductor packages | Hyungjun Park, Sangbae Park, YongGil Lee, KyungSoo Rho, JunYoung Yang +1 more | 2007-01-30 |
| 7087461 | Process and lead frame for making leadless semiconductor packages | Hyungjun Park, Sangbae Park, YongGil Lee, KyungSoo Rho, JunYoung Yang +1 more | 2006-08-08 |
| 6489218 | Singulation method used in leadless packaging process | Hyung Jun Park, Sangbae Park, Junhong LEE, Kun-A Kang, Bae Doo Kim | 2002-12-03 |