Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
SP

Sangbae Park — 9 Patents

AEAdvanced Semiconductor Engineering: 6 patents #191 of 1,073Top 20%
LG: 3 patents #10,886 of 26,165Top 45%
Seoul, KR: #6,565 of 39,741 inventorsTop 20%
Overall (All Time): #535,341 of 4,157,543Top 15%
9 Patents All Time
Sangbae Park has been granted 9 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2002 and the most recent in March 2023. Sangbae Park ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Sangbae Park in Seoul, KR.

Patents per Year

Patents granted per year, 2002 to 2023Bar chart with a peak of 1 patents in 2002.peak 12002: 1 patents20022006: 1 patents20062007: 1 patents20072008: 1 patents20082016: 1 patents20162017: 1 patents20172020: 1 patents20202022: 1 patents20222023: 1 patents2023

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11615792 Artificial intelligence-based appliance control apparatus and appliance controlling system including the same Heungkyu Lee, Jaecheol Lyu, Seungmyun BAEK 2023-03-28 $23,000
11404358 Semiconductor package device and method of manufacturing the same JunYoung Yang 2022-08-02
10679929 Semiconductor package device and method of manufacturing the same JunYoung Yang 2020-06-09
9640174 Home appliance and operation method thereof Seonghwan Noh, Sungwook Han, Chansung Jeon 2017-05-02 $44,000
9407330 Mobile terminal, home appliance and method for operating the same Chansung Jeon 2016-08-02 $63,000
7408244 Semiconductor package and stack arrangement thereof Yonggill Lee 2008-08-05 $739,000
7169651 Process and lead frame for making leadless semiconductor packages Hyungjun Park, Hyeongno Kim, YongGil Lee, KyungSoo Rho, JunYoung Yang +1 more 2007-01-30 $527,000
7087461 Process and lead frame for making leadless semiconductor packages Hyungjun Park, Hyeongno Kim, YongGil Lee, KyungSoo Rho, JunYoung Yang +1 more 2006-08-08 $458,000
6489218 Singulation method used in leadless packaging process Hyeongno Kim, Hyung Jun Park, Junhong LEE, Kun-A Kang, Bae Doo Kim 2002-12-03 $352,000