Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7456053 | Packaging method for segregating die paddles of a leadframe | Kwangwon Koh, Sangyun Lee | 2008-11-25 |
| 7408244 | Semiconductor package and stack arrangement thereof | Sangbae Park | 2008-08-05 |
| 7242081 | Stacked package structure | — | 2007-07-10 |