Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866280 | Chip package | Soo-Min Choi, Jae-Sun An, Young-Gue Lee, Sang-Jin Cha | 2014-10-21 |
| 7964953 | Stacked type chip package structure | — | 2011-06-21 |
| 7939379 | Hybrid carrier and a method for making the same | Sung-Ho Youn | 2011-05-10 |
| 7830024 | Package and fabricating method thereof | — | 2010-11-09 |
| 7701046 | Stacked type chip package structure | — | 2010-04-20 |
| 7205658 | Singulation method used in leadless packaging process | Jun-Hong Lee, Hyung Jun Park, Kun-A Kang | 2007-04-17 |
| 6773961 | Singulation method used in leadless packaging process | Jun-Hong Lee, Hyung Jun Park, Kun-A Kang | 2004-08-10 |