Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211886 | Three-dimensional multichip stack electronic package structure | Yung-Yu Hsu, Chang-An Yuan, Chang-Chun Lee, Hsien-Chie Cheng | 2007-05-01 |
| 6781225 | Glueless integrated circuit system in a packaging module | Wen-Hwa Chen, Kuo-Tai Tseng | 2004-08-24 |
| 6541834 | Silicon pressure micro-sensing device and the fabrication process | Jin-Shown Shie, Ji-Cheng Lin, Chun-Te Lin, Chih-Tang Peng, Shih-han Yu | 2003-04-01 |
| 6137174 | Hybrid ASIC/memory module package | Wen-Hwa Chen, Kuo-Tai Tseng | 2000-10-24 |
| 6034425 | Flat multiple-chip module micro ball grid array packaging | Wen-Hwa Chen, Kuo-Tai Tseng | 2000-03-07 |
| 6023097 | Stacked multiple-chip module micro ball grid array packaging | Wen-Hwa Chen, Kuo-Tai Tseng | 2000-02-08 |