Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198140 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2012-06-12 |
| 7816782 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2010-10-19 |
| 6662442 | Process for manufacturing printed wiring board using metal plating techniques | Kazunori Mune, Hirofumi Fujii, Satoshi Tanigawa | 2003-12-16 |
| 6618694 | Method, apparatus and computer program product for forming data to be analyzed by finite element method and calculation method based on finite element method | Akinobu Shibuya, Hidehito Matsuyama | 2003-09-09 |
| 6313533 | Function element, substrate for mounting function element thereon, and method of connecting them to each other | Takuo Funaya, Naoji Senba | 2001-11-06 |