Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426821 | Ion-selective electrode and production method therefor | — | 2025-09-30 |
| 11745145 | Ion-sensitive substance, ion-sensitive membrane using the same, and method for producing the ion-sensitive substance | Norihito Tsukahara | 2023-09-05 |
| 11401464 | Ceramic composite | SHINNOSUKE AKIYAMA, RIHO MORIYAMA | 2022-08-02 |
| 11322660 | Phosphor and semiconductor light emitting device using the same | SHINNOSUKE AKIYAMA, RIHO MORIYAMA, Masato Mori | 2022-05-03 |
| 11274249 | Phosphor and semiconductor light emitting device using the same | SHINNOSUKE AKIYAMA, RIHO MORIYAMA | 2022-03-15 |
| 10995935 | Phosphor and method for producing same | SHINNOSUKE AKIYAMA, Masato Mori | 2021-05-04 |
| 10982142 | Red phosphor and light emitting device using the same | RIHO MORIYAMA, SHINNOSUKE AKIYAMA | 2021-04-20 |
| 10941250 | Antistatic material, method for producing same, and antistatic film | Kazuma Oikawa | 2021-03-09 |
| 10710332 | Heat-insulation sheet, electronic device using same, and method for producing heat-insulation sheet | Kazuma Oikawa, Shinji Okada, Shigeaki Sakatani | 2020-07-14 |
| 10543660 | Heat-insulation sheet, electronic device using same, and method for producing heat-insulation sheet | Kazuma Oikawa, Shinji Okada, Shigeaki Sakatani | 2020-01-28 |
| 10290779 | Light emitting element | SHINNOSUKE AKIYAMA, Masato Mori | 2019-05-14 |
| 10259924 | Silica aerogel, heat-insulation material, and method for producing silica aerogel | Shigeaki Sakatani, Kazuma Oikawa | 2019-04-16 |
| 9937683 | Composite sheet, production method thereof and electronic apparatus using the same | Kazuma Oikawa, DAIDO KOHMYOHJI, Shigeaki Sakatani | 2018-04-10 |
| 9663376 | Xerogel production method | Kazuma Oikawa, Shigeaki Sakatani | 2017-05-30 |
| 9644057 | Resin composition and method for manufacturing the same | Kazuma Oikawa | 2017-05-09 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby | Eiji Toyoda, Takeshi Okada, Keisuke Yoshikawa, Takuya Eto, Kazuhiro Ikemura +3 more | 2007-09-11 |