Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7622311 | Inspection of underfill in integrated circuit package | Tek Seng Tan, Haris Fazelah, Ahmad Zahrain B. Mohamad Shakir | 2009-11-24 |
| 7256065 | Methods and fixture for coupling a lid to a support substrate | Seah Sun Too, Edward S. Alcid, Ahmad Juwanda, Leang Hua Kam, Tek Seng Tan | 2007-08-14 |
| 7256067 | LGA fixture for indium assembly process | Seah Sun Too, Tek Seng Tan, Kee Hean Keok | 2007-08-14 |