| 8643185 |
Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material |
Ryoichi Kajiwara, Hiroi Oka, Takuya Nakajo, Yuichi Yato |
2014-02-04 |
| 8313983 |
Fabrication method for resin-encapsulated semiconductor device |
Ryoichi Kajiwara, Shigehisa Motowaki, Hiroshi Hozoji |
2012-11-20 |
| 7964975 |
Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them |
Ryoichi Kajiwara, Shigehisa Motowaki, Hiroshi Hozoji |
2011-06-21 |
| 7879455 |
High-temperature solder, high-temperature solder paste and power semiconductor using same |
Ryoichi Kajiwara |
2011-02-01 |
| 7608917 |
Power semiconductor module |
Ryoichi Kajiwara, Kazuhiro Suzuki, Toshiaki Ishii |
2009-10-27 |
| 7528489 |
Semiconductor apparatus and manufacturing method |
Ryouichi Kajiwara, Hidemasa Kagii, Hiroi Oka, Hiroyuki Nakamura |
2009-05-05 |
| 6784554 |
Semiconductor device and manufacturing method thereof |
Ryoichi Kajiwara, Masahiro Koizumi, Masayoshi Shinoda, Akihiko Narisawa, Asao Nishimura +2 more |
2004-08-31 |