| 8310069 |
Semiconductor package having marking layer |
Wen Yu Lee |
2012-11-13 |
| 8058706 |
Delamination resistant packaged die having support and shaped die having protruding lip on support |
Chien-Te Feng, Frank Yu, Trevor Liu |
2011-11-15 |
| 7893544 |
Semiconductor device having improved contacts |
— |
2011-02-22 |
| 7829389 |
Roll-on encapsulation method for semiconductor packages |
— |
2010-11-09 |
| 7350293 |
Low profile ball-grid array package for high power |
— |
2008-04-01 |
| 7233074 |
Semiconductor device with improved contacts |
— |
2007-06-19 |
| 7192861 |
Wire bonding for thin semiconductor package |
— |
2007-03-20 |
| 7154166 |
Low profile ball-grid array package for high power |
— |
2006-12-26 |
| 6977443 |
Substrate for carrying a semiconductor chip and semiconductor device using same |
— |
2005-12-20 |
| 6969638 |
Low cost substrate for an integrated circuit device with bondpads free of plated gold |
Erwin Estepa, Joel Medina, Maria Alesssandra Azurin |
2005-11-29 |
| 6815836 |
Wire bonding for thin semiconductor package |
— |
2004-11-09 |
| 6087717 |
Semiconductor device and manufacturing method |
Kensho Murata |
2000-07-11 |
| 6060775 |
Semiconductor device |
— |
2000-05-09 |