Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8208259 | System, apparatus and method for cooling electronic components | Mark A. Wolfe | 2012-06-26 |
| 7804985 | Circuit module having force resistant construction | Leland Szewerenko, Ron Orris | 2010-09-28 |
| 7759791 | High density IC module | Leland Szewerenko, James Wehrly | 2010-07-20 |
| 7760513 | Modified core for circuit module system and method | David Roper, Paul Goodwin | 2010-07-20 |
| 7675155 | Carrier structure stacking system and method | — | 2010-03-09 |
| 7656678 | Stacked module systems | James Wehrly, David Roper, Joseph Villani | 2010-02-02 |
| 7626273 | Low profile stacking system and method | James W. Cady, James Wilder, David Roper, James Wehrly | 2009-12-01 |
| 7579687 | Circuit module turbulence enhancement systems and methods | Leland Szewerenko, Wayne Lieberman, Paul Goodwin | 2009-08-25 |
| 7572671 | Stacked module systems and methods | James Wehrly | 2009-08-11 |
| 7573129 | Contrast interposer stacking system and method | Roel Perez, Leland Szewerenko | 2009-08-11 |
| 7508069 | Managed memory component | James Wehrly, Ron Orris, Leland Szewerenko, Tim Roy, David Roper | 2009-03-24 |
| 7446403 | Carrier structure stacking system and method | — | 2008-11-04 |
| 7417310 | Circuit module having force resistant construction | Leland Szewerenko, Ron Orris | 2008-08-26 |
| 7375418 | Interposer stacking system and method | — | 2008-05-20 |
| 7371609 | Stacked module systems and methods | James Wehrly | 2008-05-13 |
| 7323364 | Stacked module systems and method | James Wehrly, David Roper | 2008-01-29 |
| 7304382 | Managed memory component | James Wehrly, Ron Orris, Leland Szewerenko, Tim Roy, David Roper | 2007-12-04 |
| 7180167 | Low profile stacking system and method | James W. Cady, James Wilder, David Roper, James Wehrly | 2007-02-20 |
| 7094632 | Low profile chip scale stacking system and method | James W. Cady, James Wehrly, James Wilder, David Roper, Jeff Buchle | 2006-08-22 |
| 7033861 | Stacked module systems and method | James Wehrly, David Roper | 2006-04-25 |
| 7026708 | Low profile chip scale stacking system and method | James W. Cady, James Wehrly, James Wilder, David Roper, Jeff Buchle | 2006-04-11 |
| 5825629 | Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment | Karl G. Hoebener, Eric M. Hubacher | 1998-10-20 |
| 5535936 | Fine pitch solder formation on printed circuit board process and product | Ku Ho Chong, Charles H. Crockett, Jr., Bhavyen S. Sanghavi | 1996-07-16 |
| 5493075 | Fine pitch solder formation on printed circuit board process and product | Ku Ho Chong, Charles H. Crockett, Jr., Bhavyen S. Sanghavi | 1996-02-20 |
| 5492266 | Fine pitch solder deposits on printed circuit board process and product | Karl G. Hoebener, Eric M. Hubacher | 1996-02-20 |