Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10116086 | Enclosure for a cable connection | William V. Dower, Scott D. Turner, David Montalion Dupuis, Curtis L. Shoemaker | 2018-10-30 |
| 9543746 | Enclosure for a cable connection | William V. Dower, Scott D. Turner, David Montalion Dupuis, Curtis L. Shoemaker | 2017-01-10 |
| 8841553 | Enclosure for a cable connection | William V. Dower, Scott D. Turner, David Montalion Dupuis, Curtis L. Shoemaker | 2014-09-23 |
| 7737549 | Circuit module with thermal casing systems | James Wehrly, Mark A. Wolfe, Paul Goodwin | 2010-06-15 |
| 7626273 | Low profile stacking system and method | Julian Partridge, James W. Cady, David Roper, James Wehrly | 2009-12-01 |
| 7626259 | Heat sink for a high capacity thin module system | James Wehrly, Paul Goodwin, Mark A. Wolfe | 2009-12-01 |
| 7606048 | Integrated circuit stacking system | James W. Cady, David Roper, Russell Rapport, James Wehrly, Jeffrey Alan Buchle | 2009-10-20 |
| 7595550 | Flex-based circuit module | James W. Cady, David Roper, James Wehrly | 2009-09-29 |
| 7586758 | Integrated circuit stacking system | James W. Cady, David Roper, Russell Rapport, James Wehrly, Jeffrey Alan Buchle | 2009-09-08 |
| 7542304 | Memory expansion and integrated circuit stacking system and method | Russell Rapport, James W. Cady, David Roper, James Wehrly, Jeff Buchle | 2009-06-02 |
| 7524703 | Integrated circuit stacking system and method | James W. Cady, David Roper, James Wehrly | 2009-04-28 |
| 7495334 | Stacking system and method | Russell Rapport, James W. Cady, David Roper, James Wehrly, Jeff Buchle +1 more | 2009-02-24 |
| 7485951 | Modularized die stacking system and method | David Roper, Curtis Hart, Phill Bradley, James Cady, Jeff Buchle +1 more | 2009-02-03 |
| 7459784 | High capacity thin module system | James Wehrly, Paul Goodwin, Mark A. Wolfe | 2008-12-02 |
| 7446410 | Circuit module with thermal casing systems | James Wehrly, Mark A. Wolfe, Paul Goodwin | 2008-11-04 |
| 7443023 | High capacity thin module system | James Wehrly, Paul Goodwin, Mark A. Wolfe | 2008-10-28 |
| 7335975 | Integrated circuit stacking system and method | James W. Cady, David Roper, Russell Rapport, James Wehrly, Jeffrey Alan Buchle | 2008-02-26 |
| 7256484 | Memory expansion and chip scale stacking system and method | Russell Rapport, James W. Cady, David Roper, James Wehrly, Jeff Buchle | 2007-08-14 |
| 7202555 | Pitch change and chip scale stacking system and method | David Roper, James W. Cady, James Wehrly, Jeff Buchle, Julian Dowden | 2007-04-10 |
| 7180167 | Low profile stacking system and method | Julian Partridge, James W. Cady, David Roper, James Wehrly | 2007-02-20 |
| 7094632 | Low profile chip scale stacking system and method | James W. Cady, Julian Partridge, James Wehrly, David Roper, Jeff Buchle | 2006-08-22 |
| 7053478 | Pitch change and chip scale stacking system | David Roper, James W. Cady, James Wehrly, Jeff Buchle, Julian Dowden | 2006-05-30 |
| 7026708 | Low profile chip scale stacking system and method | James W. Cady, Julian Partridge, James Wehrly, David Roper, Jeff Buchle | 2006-04-11 |
| 6955945 | Memory expansion and chip scale stacking system and method | Russell Rapport, James W. Cady, David Roper, James Wehrly, Jeff Buchle | 2005-10-18 |
| 6956284 | Integrated circuit stacking system and method | James W. Cady, David Roper, James Wehrly | 2005-10-18 |