Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847474 | Semiconductor package and electromagnetic interference shielding structure for the same | Woon Chun Kim, Ji Hye Shim, Sung Keun Park, Gun Lee | 2020-11-24 |
| 10790255 | Fan-out semiconductor package | Woon Chun Kim, Ji Hye Shim, Sung Keun Park, Gun Lee | 2020-09-29 |
| 8377748 | Method of manufacturing cooling fin and package substrate with cooling fin | Eung-Suek Lee, Je-Gwang Yoo, Chang-Sup Ryu, Jun Oh Hwang, Jee-Soo Mok | 2013-02-19 |
| 8222534 | Printed circuit board and manufacturing method thereof | Jee-Soo Mok, Ki Hwan Kim, Sung Yong Kim | 2012-07-17 |
| 8166647 | Method of manufacturing a printed circuit board | Jun Oh Hwang, Jee-Soo Mok, Kyung Ah Lee, Eung-Suek Lee | 2012-05-01 |
| 8161634 | Method of fabricating a printed circuit board | Jee-Soo Mok | 2012-04-24 |
| 8065798 | Method of manufacturing printed circuit board | Dong Sun Kim, Taehoon Kim, Jong Seok Song, Sam Jin Her | 2011-11-29 |
| 8058558 | Printed circuit board and manufacturing method thereof | Jee-Soo Mok, Dong-Jin Park, Ki Hwan Kim, Sung Young Kim | 2011-11-15 |
| 7841074 | Method of fabricating paste bump for printed circuit board | Jee-Soo Mok, Ki Hwan Kim, Sung Yong Kim, Sang Hyun Park | 2010-11-30 |
| 7836590 | Manufacturing method for printed circuit board | Jee-Soo Mok | 2010-11-23 |
| 7794820 | Printed circuit board and fabricating method of the same | Dong Sun Kim, Taehoon Kim, Jong Seok Song, Sam Jin Her | 2010-09-14 |
| 7653991 | Method for manufacturing printed circuit board having embedded component | Jee-Soo Mok, Ki Hwan Kim, Sung Yong Kim | 2010-02-02 |