Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6727160 | Method of forming a shallow trench isolation structure | Chian-Kai Huang, Fung-Hsu Cheng | 2004-04-27 |
| 6355974 | Method to prevent the formation of a thinner portion of insulating layer at the junction between the side walls and the bottom insulator | Ping-Wei Lin, Ming-Kuan Kao | 2002-03-12 |
| 6261966 | Method for improving trench isolation | Ping-Wei Lin, Ming-Kuan Kao, Hui-ching Lin | 2001-07-17 |
| 6261930 | Method for forming a hemispherical-grain polysilicon | Ping-Wei Lin, Ming-Kuan Kao, Yi-Shin Chang | 2001-07-17 |
| 6191003 | Method for planarizing a polycrystalline silicon layer deposited on a trench | Ping-Wei Lin, Chien-Hung Chen, Yen-Jung Chang | 2001-02-20 |
| 6171904 | Method for forming rugged polysilicon capacitor | Ping-Wei Lin, Ming-Kuan Kao | 2001-01-09 |
| 6071794 | Method to prevent the formation of a thinner portion of insulating layer at the junction between the side walls and the bottom insulator | Ping-Wei Lin, Ming-Kuan Kao | 2000-06-06 |
| 6066529 | Method for enlarging surface area of a plurality of hemi-spherical grains on the surface of a semiconductor chip | Ping-Wei Lin, Ming-Kuan Kao, Yi-Fu Chung | 2000-05-23 |