Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400970 | Semiconductor package including electromagnetic shield structure | Jongwan Kim, Yongkwan Lee, Kyonghwan Koh, Seunghwan KIM, Junwoo Park +1 more | 2025-08-26 |
| 12308253 | Molded product for semiconductor strip and method of manufacturing semiconductor package | Seunghwan KIM, Kyonghwan Koh, Jongwan Kim, Junwoo Park, Hyunggil Baek +3 more | 2025-05-20 |
| 12288743 | Semiconductor package | Junwoo Park, Seunghwan KIM, Yongkwan Lee, Dongju Jang | 2025-04-29 |
| 12205925 | Semiconductor package having package substrate | Yongkwan Lee, Seunghwan KIM, Jongwan Kim, Hyunki Kim, Junwoo Park +3 more | 2025-01-21 |
| 12087650 | Interposer and semiconductor package including the same | Junyoung Oh, Hyunggil Baek, Seunghwan KIM, Jongho Park, Yongkwan Lee | 2024-09-10 |
| 11688656 | Interposer and semiconductor package including the same | Junyoung Oh, Hyunggil Baek, Seunghwan KIM, Jongho Park, Yongkwan Lee | 2023-06-27 |
| 11538801 | Semiconductor package | Jongho Park, Seung Hwan Kim, Jun Young Oh, Yongkwan Lee, Dong-Ju Jang | 2022-12-27 |
| 10512252 | Cage farming apparatus | — | 2019-12-24 |