Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8916742 | Anatomically engineered configured article | — | 2014-12-23 |
| 7468288 | Die-level opto-electronic device and method of making same | Shahram Mostafazadeh | 2008-12-23 |
| 7405100 | Packaging of a semiconductor device with a non-opaque cover | Shahram Mostafazadeh | 2008-07-29 |
| RE39854 | Lead frame chip scale package | Shahram Mostafazadeh | 2007-09-25 |
| 7171745 | Apparatus and method for force mounting semiconductor packages to printed circuit boards | Shahram Mostafazadeh | 2007-02-06 |
| 7144800 | Multichip packages with exposed dice | Shahram Mostafazadeh | 2006-12-05 |
| 7098518 | Die-level opto-electronic device and method of making same | Shahram Mostafazadeh | 2006-08-29 |
| 7012282 | Bumped integrated circuits for optical applications | Shahram Mostafazadeh | 2006-03-14 |
| 7002241 | Packaging of semiconductor device with a non-opaque cover | Shahram Mostafazadeh | 2006-02-21 |
| 6984866 | Flip chip optical semiconductor on a PCB | Shahram Mostafazadeh, Matthew D. Penry | 2006-01-10 |
| 6936929 | Multichip packages with exposed dice | Shahram Mostafazadeh | 2005-08-30 |
| 6888228 | Lead frame chip scale package | Shahram Mostafazadeh | 2005-05-03 |
| 6823582 | Apparatus and method for force mounting semiconductor packages to printed circuit boards | Shahram Mostafazadeh | 2004-11-30 |
| 6776769 | Anatomically configured tubular body of woven or knitted fabric for pressure support of articulating joint | — | 2004-08-17 |
| 6710246 | Apparatus and method of manufacturing a stackable package for a semiconductor device | Shahram Mostafazadeh | 2004-03-23 |
| 6707148 | Bumped integrated circuits for optical applications | Shahram Mostafazedeh | 2004-03-16 |
| 6589814 | Lead frame chip scale package | Shahram Mostafazadeh | 2003-07-08 |
| 6538313 | IC package with integral substrate capacitor | — | 2003-03-25 |
| 6352878 | Method for molding a bumped wafer | Shahram Mostafazadeh | 2002-03-05 |
| 6245595 | Techniques for wafer level molding of underfill encapsulant | Luu Thanh Nguyen, Hem Takiar, Ethan Warner, Shahram Mostafazadeh | 2001-06-12 |
| 6130473 | Lead frame chip scale package | Shahram Mostafazadeh | 2000-10-10 |
| 6117710 | Plastic package with exposed die and method of making same | Shahram Mostafazadeh | 2000-09-12 |
| 6054772 | Chip sized package | Shahram Mostafazadeh | 2000-04-25 |
| 6034423 | Lead frame design for increased chip pinout | Shahram Mostafazadeh | 2000-03-07 |
| 5986340 | Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same | Shahram Mostafazadeh | 1999-11-16 |