Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255083 | Semiconductor die pickup apparatus | Jae Yeong Jung | 2025-03-18 |
| 11501981 | Methods for fabricating semiconductor packages by using a mold press with an upper chase and a lower chase | Kyung Beom SEO, Jong Hyock PARK, Song NA | 2022-11-15 |
| 10109545 | Semiconductor devices having through electrodes and methods of manufacturing the same | Jong Hoon Kim, Sung Su Park | 2018-10-23 |
| 9773756 | Semiconductor packages including molded stacked die with terrace-like edges | Jong Won Kim, Wan Choon PARK | 2017-09-26 |