Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354911 | Cu3Sn via metallization in electrical devices for low-temperature 3D-integration | Andrew Clarke, Faye Walker | 2025-07-08 |
| 11854879 | Cu3Sn via metallization in electrical devices for low-temperature 3D-integration | Andrew Clarke, Faye Walker | 2023-12-26 |
| 11659660 | Oxide liner stress buffer | Christine Frandsen, Andrew Clarke | 2023-05-23 |
| 11387916 | Three-dimensional wafer-stacked optical and radio frequency phased array transceiver system | Matthew C. Thomas, Theodore Mark Kellum | 2022-07-12 |
| 11177155 | Direct bond method providing thermal expansion matched devices | — | 2021-11-16 |
| 10971538 | PiN diode structure having surface charge suppression | Justin Gordon Adams Wehner, Christian Boemler | 2021-04-06 |
| 10784234 | Die encapsulation in oxide bonded wafer stack | Jason G. Milne | 2020-09-22 |
| 10679888 | Foundry-agnostic post-processing method for a wafer | Mary A. Teshiba | 2020-06-09 |
| 10541461 | Tile for an active electronically scanned array (AESA) | Mary A. Teshiba, Jason G. Milne, Kevin C. Rolston | 2020-01-21 |
| 10453731 | Direct bond method providing thermal expansion matched devices | — | 2019-10-22 |
| 10418406 | Hybrid sensor chip assembly and method for reducing radiative transfer between a detector and read-out integrated circuit | Sean P. Kilcoyne, John L. Vampola, Barry M. Starr, Chad W. Fulk, Christopher L. Mears | 2019-09-17 |
| 10354975 | Barrier layer for interconnects in 3D integrated device | Edward R. Soares | 2019-07-16 |
| 10354910 | Foundry-agnostic post-processing method for a wafer | Mary A. Teshiba | 2019-07-16 |
| 10242967 | Die encapsulation in oxide bonded wafer stack | Jason G. Milne | 2019-03-26 |
| 10128297 | Pin diode structure having surface charge suppression | Justin Gordon Adams Wehner, Christian Boemler | 2018-11-13 |
| 9887195 | Coaxial connector feed-through for multi-level interconnected semiconductor wafers | Mary A. Teshiba | 2018-02-06 |
| 9224768 | Pin diode structure having surface charge suppression | Justin Gordon Adams Wehner, Christian Boemler | 2015-12-29 |
| 8261372 | Golf glove | Tim Dennis, Raphael Peck | 2012-09-11 |
| 8053251 | Temperature-compensated ferroelectric capacitor device, and its fabrication | T. Kirk Dougherty | 2011-11-08 |
| 7683854 | Tunable impedance surface and method for fabricating a tunable impedance surface | Daniel F. Sievenpiper, Thomas K. Dougherty, Solomon O. Robinson | 2010-03-23 |
| 7675066 | Erase-on-demand memory cell | Thomas K. Dougherty, Tricia Veeder, Gregory D. Tracy, Stephen A. Gabelich | 2010-03-09 |
| 7635761 | Water-soluble group III polyether acid salt complexes and thin films from same | T. Kirk Dougherty | 2009-12-22 |
| 7545625 | Electrode for thin film capacitor devices | Thomas K. Dougherty, Kathleen A. Kehle | 2009-06-09 |
| D594159 | Golf glove | Tim Dennis, Raphael Peck | 2009-06-09 |
| 7335552 | Electrode for thin film capacitor devices | Thomas K. Dougherty, Kathleen A. Kehle | 2008-02-26 |