Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899292 | Top-side cooling of RF products in air cavity composite packages | Anthony M. Chiu, Craig Steinbeiser, Oleh Krutko | 2018-02-20 |
| 9659898 | Apparatuses, systems, and methods for die attach coatings for semiconductor packages | Tarak A. Railkar, Kevin J. Anderson, Walid M. Meliane | 2017-05-23 |
| 8564968 | Air cavity package including a package lid having at least one protrusion configured to facilitate coupling of the package lid with a package wall | Youngwook Heo | 2013-10-22 |
| 7880287 | Stud bumps for die alignment | Bruno Samuel, Charles L. Carpenter, Justin Everman, Benne Velsher | 2011-02-01 |
| 5055889 | Lateral varactor with staggered punch-through and method of fabrication | — | 1991-10-08 |