JT

Jialing Tong

QU Qualcomm: 1 patents #7,512 of 12,104Top 65%
📍 San Diego, CA: #15,630 of 23,606 inventorsTop 70%
🗺 California: #247,236 of 386,348 inventorsTop 65%
Overall (All Time): #2,589,053 of 4,157,543Top 65%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11676905 Integrated circuit (IC) package with stacked die wire bond connections, and related methods Kuiwon Kang, Michelle Yejin Kim, Joan Rey Villarba BUOT 2023-06-13