| 12065595 |
Adhesive sheet for temporary attachment and method for producing semiconductor device using the same |
Sera Kim, Mi JANG, Kwang Joo Lee |
2024-08-20 |
| 12024654 |
Non-conductive film and manufacturing method of semiconductor laminate |
Eun Yeong KIM, You-Jin Kyung, Kwang Joo Lee, Bora YEON, Mi JANG |
2024-07-02 |
| 11932784 |
Adhesive composition for dicing tape and dicing tape comprising the same |
Da Ae KIM, Kwang Joo Lee, Eun Yeong KIM, Mi JANG |
2024-03-19 |
| 11702571 |
Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same |
Sera Kim, Kwang Joo Lee |
2023-07-18 |
| 11466184 |
Adhesive composition |
Mi JANG, Sera Kim, Kwang Joo Lee, Bora YEON, Kwang Su Seo |
2022-10-11 |
| 11404301 |
Dicing die-bonding film |
Se Ra Kim, Mun Seop Song, Kwang Joo Lee, Yeong Im Yu |
2022-08-02 |
| 10338020 |
Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film |
Jung Hak Kim, Young-Kook Kim, Kwang Joo Lee, Hee Jung Kim, Se Ra Kim +2 more |
2019-07-02 |
| 10324016 |
Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film |
Young-Kook Kim, Jung Hak Kim, Hee Jung Kim, Se Ra Kim, Jung Ho Jo +2 more |
2019-06-18 |
