Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449890 | Methods for temporary bussing of semiconductor package substrates | Johnnie Quan, August Joseph Miller, Jr., Kurt Raab | 2016-09-20 |
| 8786075 | Electrical circuit with component-accommodating lid | John McCormick | 2014-07-22 |
| 7936033 | Micro-optical device packaging system | Bradley Morgan Haskett, John P. O'Connor, Mark Myron Miller, Sean T. Crowley, Mark Popovich | 2011-05-03 |