Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394750 | Semiconductor assemblies with redistribution structures for die stack signal routing | Owen R. Fay, Madison E. Wale, Dylan W. Southern, Dustin L. Holloway | 2025-08-19 |
| 11990446 | Semiconductor assemblies with redistribution structures for die stack signal routing | Owen R. Fay, Madison E. Wale, Dylan W. Southern, Dustin L. Holloway | 2024-05-21 |
| 11848299 | Edge-notched substrate packaging and associated systems and methods | Owen R. Fay, Madison E. Wale, Dylan W. Southern | 2023-12-19 |
| 11552045 | Semiconductor assemblies with redistribution structures for die stack signal routing | Owen R. Fay, Madison E. Wale, Dylan W. Southern, Dustin L. Holloway | 2023-01-10 |
| 11482504 | Edge-notched substrate packaging and associated systems and methods | Owen R. Fay, Madison E. Wale, Dylan W. Southern | 2022-10-25 |
| 8154126 | Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods | — | 2012-04-10 |
| 7993977 | Method of forming molded standoff structures on integrated circuit devices | Frank Hall | 2011-08-09 |
| 7772707 | Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods | — | 2010-08-10 |
| 7256074 | Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods | — | 2007-08-14 |