Issued Patents All Time
Showing 25 most recent of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152495 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2021-10-19 |
| 11081572 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2021-08-03 |
| 10629710 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2020-04-21 |
| 10600893 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2020-03-24 |
| 10109553 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2018-10-23 |
| 10068827 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2018-09-04 |
| 9978849 | SOI-MOSFET gate insulation layer with different thickness | Michel J. Abou-Khalil, Alan B. Botula, Blaine J. Gross, Mark D. Jaffe, Alvin J. Joseph +2 more | 2018-05-22 |
| 9755015 | Air gaps formed by porous silicon removal | Richard A. Phelps | 2017-09-05 |
| 9704978 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2017-07-11 |
| 9666701 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2017-05-30 |
| 9653477 | Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming | Peng Cheng, James S. Dunn, Blaine J. Gross, Qizhi Liu | 2017-05-16 |
| 9646993 | Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming | Peng Cheng, James S. Dunn, Blaine J. Gross, Qizhi Liu | 2017-05-09 |
| 9601606 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2017-03-21 |
| 9530711 | Silicon-on-insulator heat sink | Alan B. Botula, Alvin J. Joseph, Randy L. Wolf | 2016-12-27 |
| 9324628 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2016-04-26 |
| 9214561 | Thin body switch transistor | Michel J. Abou-Khalil, Alan B. Botula, Mark D. Jaffe, Alvin J. Joseph | 2015-12-15 |
| 9165819 | High linearity SOI wafer for low-distortion circuit applications | Alan B. Botula, Jeffrey E. Hanrahan, Mark D. Jaffe, Alvin J. Joseph, Dale W. Martin +1 more | 2015-10-20 |
| 9076810 | Scaling of bipolar transistors | Alvin J. Joseph, Ramana Malladi | 2015-07-07 |
| 9059269 | Silicon-on-insulator heat sink | Alan B. Botula, Alvin J. Joseph, Randy L. Wolf | 2015-06-16 |
| 8951896 | High linearity SOI wafer for low-distortion circuit applications | Alan B. Botula, Jeffrey E. Hanrahan, Mark D. Jaffe, Alvin J. Joseph, Dale W. Martin +1 more | 2015-02-10 |
| 8916467 | SOI radio frequency switch with enhanced signal fidelity and electrical isolation | Alan B. Botula, Alvin J. Joseph, Edward J. Nowak, Yun Shi | 2014-12-23 |
| 8901676 | Lateral extended drain metal oxide semiconductor field effect transistor (LEDMOSFET) having a high drain-to-body breakdown voltage (Vb), a method of forming an LEDMOSFET, and a silicon-controlled rectifier (SCR) incorporating a complementary pair of LEDMOSFETs | Michel J. Abou-Khalil, Alan B. Botula, Alvin J. Joseph, Theodore Letavic | 2014-12-02 |
| 8872236 | Scaling of bipolar transistors | Alvin J. Joseph, Ramana Malladi | 2014-10-28 |
| 8866226 | SOI radio frequency switch with enhanced electrical isolation | Alan B. Botula, Alvin J. Joseph, Edward J. Nowak, Yun Shi | 2014-10-21 |
| 8828746 | Compensation for a charge in a silicon substrate | Alan B. Botula, Mark D. Jaffe, Alvin J. Joseph, Richard A. Phelps, Randy L. Wolf | 2014-09-09 |