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High powered light emitter packages with compact optics |
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Ultra-thin ohmic contacts for p-type nitride light emitting devices |
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High efficiency Group III nitride LED with lenticular surface |
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High efficiency group III nitride LED with lenticular surface |
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High efficiency group III nitride LED with lenticular surface |
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High efficiency group III nitride LED with lenticular surface |
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Methods of forming thermoelectric devices using islands of thermoelectric material and related structures |
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Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding |
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Collets for bonding of light emitting diodes having shaped substrates |
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