HC

Hyo-geun Chae

Samsung: 6 patents #19,812 of 75,807Top 30%
📍 Anmyeon-eup, KR: #96 of 671 inventorsTop 15%
Overall (All Time): #875,179 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
7017428 Test kit for semiconductor package and method for testing semiconductor package using the same Byoung-jun Min, Jeong-Ho Bang, Hyun-Seop Shim 2006-03-28
6841425 Wafer treatment method for protecting fuse box of semiconductor chip Jae Il Lee, Jeong-Ho Bang, Young Moon LEE 2005-01-11
6489790 Socket including pressure conductive rubber and mesh for testing of ball grid array package Young-Soo An, Jae Il Lee, Jeong-Ho Bang 2002-12-03
6462534 Semiconductor package testing equipment including loader having package guider and method of loading a semiconductor package onto a test socket as aligned therewith Seong-goo Kang, Byoung-jun Min, Jeong-Ho Bang 2002-10-08
6450839 Socket, circuit board, and sub-circuit board for semiconductor integrated circuit device Byoung-jun Min, Sang Young Choi 2002-09-17
6396294 Socket pin and socket for electrical testing of semiconductor packages Young-Soo An, Young Moon LEE, Jae Il Lee 2002-05-28