HB

Hyunll Bae

SC Stats Chippac: 1 patents #162 of 253Top 65%
Overall (All Time): #3,008,057 of 4,157,543Top 75%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9385100 Integrated circuit packaging system with surface treatment and method of manufacture thereof Hun Teak Lee, YoungChul Kim, HeeSoo Lee, HeeJo Chi 2016-07-05