Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237208 | Semiconductor device including device isolation layer with multiple patterns | Hyunchul Lee, Ki-Jeong Kim, Hyun-Sil HONG | 2025-02-25 |
| 9312213 | Bump structures having an extension | Moon Gi Cho, Young Lyong Kim, Sun-Hee Park | 2016-04-12 |
| 9013109 | Light-emitting diode lighting device with adjustable current settings and switch voltages | Yung-Hsin Chiang, Yi-Mei Li, Woung-Moo Lee | 2015-04-21 |
| 8928150 | Multi-chip package and method of manufacturing the same | Moon Gi Cho, Sun-Hee Park, Yong-Hwan Kwon | 2015-01-06 |
| 8823172 | Semiconductor package and method for fabricating the same | Sunwon Kang, Jongho Lee | 2014-09-02 |
| 8759221 | Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages | Jin-Woo Park, Eunchul Ahn | 2014-06-24 |
| 8680685 | Semiconductor package and method for fabricating the same | Sunwon Kang, Jongho Lee | 2014-03-25 |
| 8519470 | Semiconductor chip, and semiconductor package and system each including the semiconductor chip | Sun-Won Kang | 2013-08-27 |
| 8497569 | Package substrates and semiconductor packages having the same | Jin-Woo Park, Eunchul Ahn | 2013-07-30 |