Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6219238 | Structure for removably attaching a heat sink to surface mount packages | Frank E. Andros, Michael A. Gaynes, Wayne R. Storr | 2001-04-17 |
| 5814877 | Single layer leadframe design with groundplane capability | Steven Joel Diffenderfer | 1998-09-29 |
| 5785799 | Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy | Thomas M. Culnane, Michael A. Gaynes, Ping Kwong Seto | 1998-07-28 |
| 5744863 | Chip carrier modules with heat sinks attached by flexible-epoxy | Thomas M. Culnane, Michael A. Gaynes, Ping Kwong Seto | 1998-04-28 |
| 5672548 | Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy | Thomas M. Culnane, Michael A. Gaynes, Ping Kwong Seto | 1997-09-30 |
| 5639694 | Method for making single layer leadframe having groundplane capability | Steven Joel Diffenderfer | 1997-06-17 |
| 5543657 | Single layer leadframe design with groundplane capability | Steven Joel Diffenderfer | 1996-08-06 |
| 4964737 | Removable thermocouple template for monitoring temperature of multichip modules | Don L. Baker, Glenn D. Gilda, Terrence A. Quinn | 1990-10-23 |