Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728480 | Passivation layer and method of making a passivation layer | Kurt Matoy, Christian Krenn, Elfriede Kraxner Wellenzohn, Helmut Schoenherr, Juergen Steinbrenner +5 more | 2017-08-08 |
| 9490103 | Separation of chips on a substrate | Manfred Engelhardt, Gudrun Stranzl, Markus Zundel | 2016-11-08 |
| 9490173 | Method for processing wafer | — | 2016-11-08 |
| 9219011 | Separation of chips on a substrate | Manfred Engelhardt, Gudrun Stranzl, Markus Zundel | 2015-12-22 |
| 9059182 | Method for producing bonding connection of semiconductor device | Thomas Detzel | 2015-06-16 |
| 7834427 | Integrated circuit having a semiconductor arrangement | Thomas Detzel, Kai-Alexander Schreiber, Stefan Woehlert, Uwe Hoeckele | 2010-11-16 |
| 7718505 | Method of forming a semiconductor structure comprising insulating layers with different thicknesses | Nicola Vannucci | 2010-05-18 |
| 7531439 | Method for forming an integrated semiconductor circuit arrangement | Johann Rieger, Stefan Lipp, Hans Zeindl, Thomas Detzel | 2009-05-12 |
| 6605841 | Method for producing an electrode by means of a field effect controllable semiconductor component and field-effect-controllable semiconductor component | Sven Lanzerstorfer | 2003-08-12 |