Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033923 | Semiconductor package structure having a lead frame and a passive component | Chi-Tsung Chiu, Chun Hao Chiu, Chiuan-You Ding | 2024-07-09 |
| 11728252 | Semiconductor device package | Hui Hua LEE, Chun Hao Chiu, Kuo-Hua Chen, Chi-Tsung Chiu | 2023-08-15 |
| 11133245 | Semiconductor package structure and method for manufacturing the same | Chi-Tsung Chiu, Kuo-Hua Chen, Cheng-Yuan Chen | 2021-09-28 |
| 11127707 | Semiconductor package structure and method for manufacturing the same | Chi-Tsung Chiu, Hui Hua LEE, Cheng-Yuan Chen | 2021-09-21 |
| 11037868 | Semiconductor device package and method of manufacturing the same | Hui Hua LEE, Cheng-Hung Ko, Chi-Tsung Chiu | 2021-06-15 |
| 10707157 | Semiconductor device package | Hui Hua LEE, Chun Hao Chiu, Kuo-Hua Chen, Chi-Tsung Chiu | 2020-07-07 |
| 10615105 | Semiconductor device package and method of manufacturing the same | Hui Hua LEE, Cheng-Hung Ko, Chi-Tsung Chiu | 2020-04-07 |
| 10083888 | Semiconductor device package | Chi-Tsung Chiu, Meng-Jen Wang, Cheng-Hsi CHUANG, Hui Hua LEE | 2018-09-25 |
| 8889488 | Method for manufacturing semiconductor package | Shin-Hua Chao, Chao-Yuan Liu, Chih-Ming Chung | 2014-11-18 |
| 8546950 | Semiconductor package and manufacturing method thereof | Shin-Hua Chao, Chao-Yuan Liu, Chih-Ming Chung | 2013-10-01 |