Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12098257 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Yiqun Wang, Hiroharu Inoue | 2024-09-24 |
| 11905409 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Kosuke Tsuda, Yiqun Wang, Hiroharu Inoue | 2024-02-20 |
| 11477883 | Metal-clad laminate, metal foil with resin, and wiring board | Kosuke Tsuda, Hiroaki Fujiwara | 2022-10-18 |
| 10870721 | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board | Yuki Kitai, Hiroaki Fujiwara | 2020-12-22 |
| 10590223 | Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board | Yuki Kitai, Hiroaki Fujiwara | 2020-03-17 |
| 10047213 | Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Hiroaki Fujiwara, Yuki Kitai | 2018-08-14 |
| 9708468 | Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board | Yuki Kitai, Hiroaki Fujiwara | 2017-07-18 |
| 9637598 | Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used | Hiroaki Fujiwara, Yuki Kitai | 2017-05-02 |
| 9567481 | Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board | Hiroaki Fujiwara, Yuki Kitai | 2017-02-14 |
| 9528026 | Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board | Takashi Sagara, Hidetaka Kakiuchi, Keiko Kashihara, Yuki Kitai, Daisuke Yokoyama +1 more | 2016-12-27 |