Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412824 | Semiconductor packages and methods of forming the same | Yeongbeom Ko, Junyun Kweon, Wooju Kim, Haemin Park, Junggeun Shin | 2025-09-09 |
| 12062626 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Byungmoon Bae, Junggeun Shin, Hyunsu Sim, Junho Yoon +1 more | 2024-08-13 |
| 12015005 | Semiconductor package including non-conductive film and method for forming the same | Yeongbeom Ko, Wooju Kim, Jungseok Ryu, Haemin Park | 2024-06-18 |
| 11676914 | Semiconductor substrate and method of sawing the same | Hwayoung Lee, Byungmoon Bae, Junggeun Shin, Hyunsu Sim, Junho Yoon +1 more | 2023-06-13 |