Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Chun Ho Fan, Neil Robert McLellen | 2006-03-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7015072 | Method of manufacturing an enhanced thermal dissipation integrated circuit package | Edward Combs, Robert Sheppard, Tai Wai Pun, Chun Ho Fan, Neil Robert McLellen | 2006-03-21 |