Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7064446 | Under bump metallization layer to enable use of high tin content solder bumps | John Barnak, Gerald Feldewerth, Ming Fang, Kevin J. Lee, Tzuen-Luh Huang +3 more | 2006-06-20 |