Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327810 | Die surface treatment apparatus and die bonding system including the same | Min Young Kim, Ji Hoon Park | 2025-06-10 |
| 9620476 | Bonding head and die bonding apparatus having the same | Jong Jin Weon, Soon Hyun KIM, Seung Dae Seok | 2017-04-11 |