Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053371 | Apparatus and methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Hugh E. Stroupe, Todd A. Dobson, Brian F. Gordon | 2011-11-08 |
| 7294570 | Contact integration method | Richard L. Elliott | 2007-11-13 |
| 7244681 | Methods for selective removal of material from wafer alignment marks | Hugh E. Stroupe, Todd A. Dobson, Brian F. Gordon, Russell C. Zahorik | 2007-07-17 |
| 7214125 | Method for controlling pH during planarization and cleaning of microelectronic substrates | Judson R. Sharples, Kenneth F. Zacharias | 2007-05-08 |
| RE39413 | Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers | Russell C. Zahorik | 2006-11-28 |
| 7122475 | Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies | — | 2006-10-17 |
| 7045017 | Method for post chemical-mechanical planarization cleaning of semiconductor wafers | David Gonzales | 2006-05-16 |
| 6913523 | Method for controlling pH during planarization and cleaning of microelectronic substrates | Judson R. Sharples, Kenneth F. Zacharias | 2005-07-05 |
| 6889698 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Hugh E. Stroupe, Todd A. Dobson, Brian F. Gordon | 2005-05-10 |
| 6803316 | Method of planarizing by removing all or part of an oxidizable material layer from a semiconductor substrate | Michael A. Walker | 2004-10-12 |
| 6794289 | Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies | — | 2004-09-21 |
| 6716089 | Method for controlling pH during planarization and cleaning of microelectronic substrates | Judson R. Sharples, Kenneth F. Zacharias | 2004-04-06 |
| 6713384 | Contact integration method | Richard L. Elliott | 2004-03-30 |
| 6640816 | Method for post chemical-mechanical planarization cleaning of semiconductor wafers | David Gonzales | 2003-11-04 |
| 6635574 | Method of removing material from a semiconductor substrate | Michael A. Walker | 2003-10-21 |
| 6610610 | Methods for selective removal of material from wafer alignment marks | Russell C. Zahorik, Hugh E. Stroupe, Todd A. Dobson, Brian F. Gordon | 2003-08-26 |
| 6593657 | Contact integration article | Richard L. Elliott | 2003-07-15 |
| 6530113 | Apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Hugh E. Stroupe, Todd A. Dobson, Brian F. Gordon | 2003-03-11 |
| 6447634 | Method and apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Hugh Stroupe, Todd A. Dobson, Brian F. Gordon | 2002-09-10 |
| 6440319 | Method and apparatus for predicting process characteristics of polyurethane pads | Scott Meikle | 2002-08-27 |
| 6407000 | Method and apparatuses for making and using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies | — | 2002-06-18 |
| 6379225 | Planarization process with abrasive polishing slurry that is selective to a planarized surface | Karl M. Robinson, Scott Meikle | 2002-04-30 |
| 6368194 | Apparatus for controlling PH during planarization and cleaning of microelectronic substrates | Judson R. Sharples, Kenneth F. Zacharias | 2002-04-09 |
| 6329301 | Method and apparatus for selective removal of material from wafer alignment marks | Russell C. Zahorik, Hugh E. Stroupe, Todd A. Dobson, Brian F. Gordon | 2001-12-11 |
| 6273101 | Method for post chemical-mechanical planarization cleaning of semiconductor wafers | David Gonzales | 2001-08-14 |